WO2002073673A9 - A micro-electro-mechanical switch and a method of using and making thereof - Google Patents

A micro-electro-mechanical switch and a method of using and making thereof

Info

Publication number
WO2002073673A9
WO2002073673A9 PCT/US2002/007518 US0207518W WO02073673A9 WO 2002073673 A9 WO2002073673 A9 WO 2002073673A9 US 0207518 W US0207518 W US 0207518W WO 02073673 A9 WO02073673 A9 WO 02073673A9
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
chamber
set forth
switch
insulating layer
Prior art date
Application number
PCT/US2002/007518
Other languages
French (fr)
Other versions
WO2002073673A1 (en
Inventor
Michael D Potter
Original Assignee
Rochester Inst Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rochester Inst Tech filed Critical Rochester Inst Tech
Publication of WO2002073673A1 publication Critical patent/WO2002073673A1/en
Publication of WO2002073673A9 publication Critical patent/WO2002073673A9/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H2059/009Electrostatic relays; Electro-adhesion relays using permanently polarised dielectric layers

Definitions

  • This invention relates generally to switches and, more particularly, to a micro-electro-mechanical switch (MEMS) and a method of using and making thereof.
  • MEMS micro-electro-mechanical switch
  • Micro-electro-mechanical switches are operated by an electrostatic charge, thermal, piezoelectric or other actuation mechanism.
  • Application of an electrostatic charge to a control electrode in the MEMS causes the switch to close, while removal of the electrostatic charge on the control electrode, allowing the mechanical spring restoration force of the armature to open the switch.
  • cantilever type MEMS For example, one problem with cantilever type MEMS is that they often freeze into a closed position due to a phenomenon known as stiction. These cantilever type MEMS may be actuated by electrostatic forces, however there is no convenient way to apply a force in the opposite direction to release the MEMS . to the open position.
  • the improved switch includes an insulating substrate, a conductive contact, a cantilever support, a first conductive surface and a cantilever beam. Additionally, a first control surface is provided on the lower surface of and is insulated from the beam by a layer of insulation. A second control surface is disposed over and is separated from the first conductive surface by a layer of insulative material. A variable capacitor is formed by the two control surfaces and the dielectric between them. This capacitor must be considered in addition to the capacitors formed by the first control surface, the layer of insulation and the beam and by the second control surface, the layer of insulation and the first conductive surface.
  • a switch in accordance with one embodiment of the present invention includes at least one portion of a conductive line in the chamber, a beam with imbedded charge, and control electrodes.
  • the beam has a conductive section which is positioned in substantial alignment with the at least one portion of the conductive line.
  • the conductive section of the beam has an open position spaced away from the conductive line and a closed position on the conductive line.
  • Each of the control electrodes is spaced away from an opposing side of the beam to control movement of the beam.
  • a method for making a switch in accordance with another embodiment of the present invention includes forming a chamber in a switch housing, forming separated portions of a conductive line in the chamber, forming a beam with imbedded charge which extends into the chamber, and forming a pair of control electrodes spaced away from opposing sides of the beam.
  • the beam has a conductive section located at or adjacent an edge of the beam and which is positioned in substantial alignment with the separated portions of the conductive line.
  • the conductive section of the beam has an open position spaced away from the separated portions of the conductive line and a closed position on a part of each of the separated portions of the conductive line to couple the separated portions of the conductive line together.
  • a method of using a switch in accordance with another embodiment of the present invention includes applying a first potential to control electrodes and moving a conductive section on a beam to one of an open position spaced away from at least one portion of a conductive line or a closed position on the at least one portion of the conductive line in response to the applied first potential.
  • the beam has imbedded charge and a conductive section that is located at or adjacent an edge of the beam and is positioned in substantial alignment with the at least one portion of a conductive line.
  • Each of the control electrodes is spaced away from an opposing side of the beam to control movement of the beam.
  • a method for making a switch in accordance with another embodiment of the present invention includes forming at least one portion of a conductive line, forming a beam with imbedded charge, and forming control electrodes.
  • the beam has a conductive section which is positioned in substantial alignment with the at least one portion of the conductive line.
  • the conductive section of the beam has an open position spaced away from the at least one portion of the conductive line and a closed position on the at least one portion of the conductive line.
  • Each of the control electrodes is spaced away from an opposing side of the beam to control movement of the beam.
  • a method for making a switch in accordance with another embodiment of the present invention includes filling at least three trenches in a base material with a first conductive material.
  • the first conductive material in two of the trenches forms separated portions of a conductive line and the first conductive material in the other trench forms a first control electrode.
  • a first insulating layer is deposited on at least a portion of the first conductive material and the base material.
  • a trench is formed in a portion of the first insulating layer which extends to at least a portion of the first conductive material in the trenches in the base material.
  • the trench in the portion of the first insulating layer is filled with a first sacrificial material.
  • a trench is formed in the first sacrificial material which is at least partially in alignment with at least a portion of the first conductive material in the trenches in the base material that form the separated portions of the conductive line.
  • the trench in the first sacrificial material is filled with a second conductive material to form a contactor.
  • a charge holding beam is formed over at least a portion of the first insulating layer, the first sacrificial material, and the second conductive material in the trench in the first sacrificial material.
  • the beam is connected to the beam.
  • a second insulating layer is deposited over at least a portion of the beam, the first sacrificial material, and the first insulating layer.
  • a trench is formed in the second insulating layer which extends to at least a portion of the beam and the first sacrificial material.
  • the trench in the second insulating layer is filled with a second sacrificial material.
  • a charge is inbedded on the beam.
  • a third conductive material is deposited over at least a portion of the second insulating layer and the second sacrificial material.
  • a second control electrode is formed from the third conductive material over at least a portion of the second insulating layer and the second sacrificial material.
  • a third insulating layer is deposited over at least a portion of the second control electrode, the second sacrificial material, and the second insulating layer.
  • At least one access hole is formed to the first and second sacrificial materials. The first and second sacrificial materials are removed to form a chamber and sealing the access hole to form a vacuum or a gas filled chamber.
  • the present invention provides a switch that utilizes fixed static charge to apply attractive and repulsive forces for activation. With the present invention, the parasitic capacitance is minimal, while the switching speed or response is high. The switch does not add extra mass and only requires one power supply.
  • the present invention can be used in a variety of different applications, such as wireless communications, cell phones, robotics, micro-robotics, and/or autonomous sensors.
  • FIG. 1 is a cross sectional, side view of a switch in accordance with one embodiment of the present invention
  • FIG. 2A is a cross sectional, side view of a switch in accordance with another embodiment of the present invention.
  • FIG. 2B is a cross sectional, side view of a switch in accordance with yet another embodiment of the present invention.
  • FIGS. 3 and 5-11 are cross sectional, side views of steps in a method of making a switch in accordance with another embodiment of the present invention.
  • FIG. 4 is a partial, cross sectional, top-view of a step in the method of making the switch.
  • FIGS. 12-14 are partial, cross sectional, top-view of additional steps in the method of making the switch.
  • FIG. 1 A switch 10(1) in accordance with at least one embodiment of the present invention is illustrated in FIG. 1.
  • the switch 10(1) includes a switch housing 12 with a chamber 14, separated portions of a conductive line 16(1) and 16(2), a beam 18 with imbedded charge and a contactor 20, and control electrodes 22(1) and 22(2).
  • the present invention provides a switch 10(1) that utilizes fixed static charge to apply attractive and repulsive forces for activation of the switch and to overcome stiction.
  • This switch 10(1) has lower power requirements to operate, less parasitic capacitance, less mass, and faster switching speed or response than prior designs.
  • the switch housing 12 defines a chamber 14 in which the switch 10(1) is located.
  • the switch housing 12 is made of several layers of an insulating material, such as silicon dioxide, although other types of materials can be used and the switch housing 12 could comprise a single layer of material in which the chamber 14 is formed.
  • the chamber 14 has a size which is sufficiently large to hold the components of the switch 10(1), although the chamber 14 can have other dimensions.
  • the control electrodes 22(1) and 22(2) in the switch housing 12 may be separated from each other by a distance of about one micron with each of the control electrodes 22(1) and 22(2) spaced from the beam 18 by about 0.5 microns, although these dimensions can vary based on the particular application.
  • the chamber 14 has an access hole 17 used in removing sacrificial material from the chamber 14 although the chamber 14 can have other numbers of access holes.
  • a plug 19 seals the access hole 17.
  • the chamber 14 is vacuum sealed, although it is not required.
  • the switch housing 12 is vacuum sealed which helps to protect the switch 10(1) from contaminates which, for example, might be attracted and adhere to the beam 18 with the imbedded charge.
  • each of the separated portions 16(1) and 16(2) of the conductive line or conductor has an end 24(1) and 24(2) which is adjacent to and spaced from the other end 24(1) and 24(2) in the chamber 14 to form an open circuit along the conductive line.
  • the other end 26(1) and 26(2) of each of the separated portions of the conductive line extends out from the chamber to form a contact pad.
  • the separated portions 16(1) and 16(2) of the conductive line are made of a conductive material, such as copper, although another material or materials could be used.
  • the beam 18 has one end 28(1) which is secured to the switch housing 12 and the other end 28(2) of the beam 18 extends into the chamber 14 and is spaced from the other side of the chamber 14, although other configurations for the beam 18 can be used.
  • both ends 28(1) and 28(2) of the beam 18 could be secured to the switch housing 12, although this embodiment would provide less flexibility than having the beam 18 secured at just one end 28(1) to the switch housing 12 as shown in FIGS. 1 and 2.
  • the beam 18 is made of a material which can hold an imbedded charge.
  • the beam 18 is made of a composite of silicon oxide and silicon nitride, although the beam 18 could be made of another material or materials.
  • the beam 18 could be a composite of a plurality of layers of different materials.
  • the contactor 20 is located at or adjacent one end 28(2) of the beam 18, although the contactor 20 could be located in other locations or could be part of the end 28(1) or another section of the beam 18 that was made conductive.
  • the contactor 20 is positioned on the beam 18 to be in substantial alignment with the ends 24(1) and 24(2) of the separated portions 16(1) and 16(2) of the conductive line.
  • the contactor 20 is made of a conductive material, such as copper, although another material or materials could be used.
  • the contactor 20 In an open position, the contactor 20 is spaced away from the ends 24(1) and 24(2) of the separated portions 16(1) and 16(2) of the conductive line and in a closed position the contractor 20 is located on the ends 24(1) and 24(2) of each of the separated portions 16(1) and 16(2) of the conductive line to couple the separated portions 16(1) and 16(2) of the conductive line together.
  • control electrodes 22(1) and 22(2) are located in the chamber 14 of the switch housing 12 and are spaced away from opposing sides of the beam 18, although other configurations are possible.
  • one of the control electrodes 22(1) could be located outside of the chamber 14, as shown in the switch 10(2) in FIG. 2 or both of the control electrodes 22(1) and 22(2) could be located outside of the chamber 14.
  • Each of the control electrodes 22(1) and 22(2) is made of a conductive material, such as chrome, although another material or materials could be used.
  • a power supply 30 is coupled to each of the control electrodes 22(1) and 22(2) and is used to apply the potential to the control electrodes 22(1) and 22(2) to open and close the switch 10(1).
  • the operation of the switch 10(1) will now be described with reference to FIG. 1.
  • the switch 10(1) is operated by applying a potential across the control electrodes 22(1) and 22(2).
  • a potential is applied across the control electrodes 22(1) and 22(2)
  • the beam 18 with the imbedded charge is drawn towards one of the control electrodes 22(1) or 22(2) depending on the polarity of the applied potential.
  • This movement of the beam 18 towards one of the control electrodes 22(1) or 22(2) moves the contactor 20 to a closed position resting on ends 24(1) and 24(2) of each of the separated portions 16(1) and 16(2) of the conductive line to couple them together.
  • the switch 10(1) is controlled by electrostatic forces that can be applied to both close and to open the switch 10(1). No extraneous current path exists, the energy used to open and close the switch is limited to capacitively coupled displacement current, and the dual force directionality overcomes stiction.
  • FIGS. 2 A and 2B are identical to those for the switch 10(1) shown and described with reference FIG. 1, except as described and illustrated herein.
  • Components in FIGS. 2 A and 2B which are identical to components in FIG. 1 have the same reference numeral as those in FIG. 1.
  • control electrode 22(2) is located outside of the chamber 14.
  • a portion 29 of the switch housing 12 separates the control electrode 22(2) from the chamber 14.
  • portion 29 is made of an insulating material although another material or materials could be used.
  • control electrode 22(1) could be outside of chamber 14 and control electrode 22(2) could be inside chamber 14.
  • FIG. 2B control electrodes 22(1) and 22(2) are located outside of the chamber 14.
  • Portions 29 and 31 of the switch housing 12 separate the control electrodes 22(1) and 22(2) from the chamber 14.
  • portions 29 and 31 of the switch housing 12 are each made of an insulating material, although another material or materials could be used.
  • FIGS. 3-14 a method for making a switch 10(1) in accordance with at least one embodiment will be described.
  • three trenches 32, 34, and 36 are etched into a base material 38.
  • Two of the etched trenches 32 and 34 have ends located adjacent and spaced from each other and are used in the forming the separated portions 16(1) and 16(2) of the conductive line.
  • the other trench 36 is used to form one of the control electrodes 22(1).
  • etching is used in this particular embodiment to form the trenches 32, 34, and 36, other techniques for forming the trenches or opening can also be used.
  • a conductive material 40 is deposited in the trenches in the base material 38.
  • the conductive material 40 in the two trenches 32 and 34 with the adjacent ends forms the separated portions 16(1) and 16(2) of the conductive line.
  • the conductive material 40 in the other trench 36 forms control electrode 22(1).
  • the conductive material 40 deposited in these trenches 32, 34, and 36 may also be planarized. Again although in this embodiment, the control electrodes 22(1) is formed in the chamber 14 of the switch housing 12, the control electrode 22(1) could be positioned outside of the switch housing 12.
  • an insulating material 42 is deposited over the base material 38 and the conductive material 40 in the trenches 32, 34, and 36.
  • silicon dioxide, SiO 2 is used as the insulating material 42, although other types of insulating materials can be used.
  • the insulating material 42 is deposited, the insulating material 42 is etched to extend down to a portion of the conductive material 40 in the trenches 32, 34, and 36.
  • a sacrificial material 44 is deposited in the etched opening or trench 46 in the insulating material.
  • polysilicon is used as the sacrificial material 44, although another material or materials can be used.
  • the sacrificial material 44 may be planarized. Although etching is used in this particular embodiment to form opening or trench 46, other techniques for forming trenches or openings can be used.
  • a trench 48 is etched into the sacrificial material 44 at a location which is in alignment with a portion of the conductive material 40 in the trenches that form the separated portions 16(1) and 16(2) of the conductive line.
  • a conductive material 50 is deposited in the trench 48 in the sacrificial material 44 to form a contactor 20.
  • the conductive material 50 may be planarized. Although etching is used in this particular embodiment to form opening or trench 48, other techniques for forming trenches or openings can be used.
  • an insulator 52 comprising a pair of insulating layers is deposited over the insulating material 42, the sacrificial material 44, and the conductive material 44 that forms the contactor 20.
  • the insulator 52 is patterned to form a cantilever charge holding beam 18 which extends from the insulating layer 42 across a portion of the sacrificial layer 44 and is connected to the contactor 20.
  • the beam 18 is patterned, other techniques for forming the beam 18 can be used.
  • insulator 52 comprises two insulating layers, insulator 52 can be made of more or fewer layers and can be made of another material or materials that can hold fixed charge.
  • an insulating material 54 is deposited over the insulating material 42, the beam 18, and the sacrificial material 44.
  • a trench 56 is etched into the insulating material 54 which extends down to a portion of the beam 18 and the sacrificial material 44.
  • a sacrificial material 58 is deposited in the trench 56 in the insulating material 54.
  • the sacrificial material 58 can be planarized. Sacrificial material 58 can be made of the same or a different material from sacrificial layer 44 and in this embodiment is polysilicon, although another material or materials could be used. Although etching is used in this particular embodiment to form opening or trench 56, other techniques for forming trenches or openings can be used.
  • electrons are injected into the beam 18 from a ballistic energy source 60 to imbed charge in the beam 18, although other techniques for imbedding the electrons can be used, such as applying an electrical bias to the beam 18.
  • a conductive material 62 is deposited over the insulating material 54 and the sacrificial material 58.
  • the conductive material 62 is etched to form a control electrode 22(2) for the switch 10(1).
  • the control electrode 22(2) is formed by patterning, other techniques for forming the control electrode can be used.
  • an insulating material 64 is deposited over the conductive material, the sacrificial material, and the insulating material.
  • the base material 38 and insulating materials 42, 54, and 64 form the switch housing 12 with the chamber 14 which is filled with the sacrificial materials 44 and 58, although switch housing 12 could be made from one or other numbers of layers.
  • an access hole 66 is drilled through the insulating layer 64 to the sacrificial material 58. Although in this particular embodiment a single access hole 66 is etched, other numbers of access holes can be formed and the hole or holes can be formed through other materials to the sacrificial material 44 and 58. Contact vias to separated portions 16(1) and 16(2) of the conductive line and control electrodes 22(1) and 22(2) may also be etched or otherwise formed at this time.
  • the chamber 14 is vacuum sealed when the sacrificial materials 44 and 58 are removed and access hole 66 is sealed with a plug 68, although the chamber 14 does not have to be vacuum sealed. Once the chamber 14 is sealed, the switch is ready for use.
  • the present invention provides a switch that utilizes fixed static charge to apply attractive and repulsive forces for activation and is easy to manufacture.
  • one method for making a switch is disclosed, other steps in this method and other methods for making the switch can also be used.
  • other techniques for imbedding charge in the beam can be used, such as applying a bias to the beam to imbed charge.

Abstract

A micro-electro-mechanical switch (10(1)) including at least one portion of a conductive line (16(1-2)) in the chamber (12), a beam (18) with an imbedded charge, and control electrodes (22(1-2)). The beam (18) has a conductive section (20) which is positioned in substantial alignment with the at least one portion of the conductive line (16(1-2)). The conductive section (20) of the beam (18) has an open position spaced away from the at least one portion of the conductive line (16(1-2)). Each of the control electrodes (22(1-2)) is spaced away from an opposing side of the beam (18) to control movement of the beam (18).

Description

A MICRO-ELECTRO-MECHANICAL SWITCH AND A METHOD OF USING AND MAKING THEREOF
[0001] The present invention claims the benefit of U.S. Provisional Patent
Application Serial No. 60/275,386, filed March 13, 2001, which is hereby incorporated by reference in its entirety.
FIELD OF THE INVENTION
[0002] This invention relates generally to switches and, more particularly, to a micro-electro-mechanical switch (MEMS) and a method of using and making thereof.
BACKGROUND OF THE INVENTION
[0003] Micro-electro-mechanical switches are operated by an electrostatic charge, thermal, piezoelectric or other actuation mechanism. Application of an electrostatic charge to a control electrode in the MEMS causes the switch to close, while removal of the electrostatic charge on the control electrode, allowing the mechanical spring restoration force of the armature to open the switch. Although these MEMS switches work problems have prevented their more widespread use.
[0004] For example, one problem with cantilever type MEMS is that they often freeze into a closed position due to a phenomenon known as stiction. These cantilever type MEMS may be actuated by electrostatic forces, however there is no convenient way to apply a force in the opposite direction to release the MEMS . to the open position.
[0005] One solution to this problem is a design which uses electrostatic repulsive forces to force apart MEMS contacts, such as the one disclosed in U.S. Patent No. 6,127,744 to R. Streeter et al. which is herein incorporated by reference. In this design, the improved switch includes an insulating substrate, a conductive contact, a cantilever support, a first conductive surface and a cantilever beam. Additionally, a first control surface is provided on the lower surface of and is insulated from the beam by a layer of insulation. A second control surface is disposed over and is separated from the first conductive surface by a layer of insulative material. A variable capacitor is formed by the two control surfaces and the dielectric between them. This capacitor must be considered in addition to the capacitors formed by the first control surface, the layer of insulation and the beam and by the second control surface, the layer of insulation and the first conductive surface.
[0005] Unfortunately, there are drawbacks to this design. As discussed above, the additional layers used for attraction or repulsion charge form capacitors which require additional power for operation and thus impose a serious limitation on this type of design. These additional layers also add mass that limits the response time of the switch. Further, this design results in a variable parasitic capacitor between the cantilever beam and contact post.
SUMMARY OF THE INVENTION [0007] A switch in accordance with one embodiment of the present invention includes at least one portion of a conductive line in the chamber, a beam with imbedded charge, and control electrodes. The beam has a conductive section which is positioned in substantial alignment with the at least one portion of the conductive line. The conductive section of the beam has an open position spaced away from the conductive line and a closed position on the conductive line. Each of the control electrodes is spaced away from an opposing side of the beam to control movement of the beam.
[0008] A method for making a switch in accordance with another embodiment of the present invention includes forming a chamber in a switch housing, forming separated portions of a conductive line in the chamber, forming a beam with imbedded charge which extends into the chamber, and forming a pair of control electrodes spaced away from opposing sides of the beam. The beam has a conductive section located at or adjacent an edge of the beam and which is positioned in substantial alignment with the separated portions of the conductive line. The conductive section of the beam has an open position spaced away from the separated portions of the conductive line and a closed position on a part of each of the separated portions of the conductive line to couple the separated portions of the conductive line together. [0009] A method of using a switch in accordance with another embodiment of the present invention includes applying a first potential to control electrodes and moving a conductive section on a beam to one of an open position spaced away from at least one portion of a conductive line or a closed position on the at least one portion of the conductive line in response to the applied first potential. The beam has imbedded charge and a conductive section that is located at or adjacent an edge of the beam and is positioned in substantial alignment with the at least one portion of a conductive line. Each of the control electrodes is spaced away from an opposing side of the beam to control movement of the beam.
[0010] A method for making a switch in accordance with another embodiment of the present invention includes forming at least one portion of a conductive line, forming a beam with imbedded charge, and forming control electrodes. The beam has a conductive section which is positioned in substantial alignment with the at least one portion of the conductive line. The conductive section of the beam has an open position spaced away from the at least one portion of the conductive line and a closed position on the at least one portion of the conductive line. Each of the control electrodes is spaced away from an opposing side of the beam to control movement of the beam.
[0011] A method for making a switch in accordance with another embodiment of the present invention includes filling at least three trenches in a base material with a first conductive material. The first conductive material in two of the trenches forms separated portions of a conductive line and the first conductive material in the other trench forms a first control electrode. A first insulating layer is deposited on at least a portion of the first conductive material and the base material. A trench is formed in a portion of the first insulating layer which extends to at least a portion of the first conductive material in the trenches in the base material. The trench in the portion of the first insulating layer is filled with a first sacrificial material. A trench is formed in the first sacrificial material which is at least partially in alignment with at least a portion of the first conductive material in the trenches in the base material that form the separated portions of the conductive line. The trench in the first sacrificial material is filled with a second conductive material to form a contactor. A charge holding beam is formed over at least a portion of the first insulating layer, the first sacrificial material, and the second conductive material in the trench in the first sacrificial material. The beam is connected to the beam. A second insulating layer is deposited over at least a portion of the beam, the first sacrificial material, and the first insulating layer. A trench is formed in the second insulating layer which extends to at least a portion of the beam and the first sacrificial material. The trench in the second insulating layer is filled with a second sacrificial material. A charge is inbedded on the beam. A third conductive material is deposited over at least a portion of the second insulating layer and the second sacrificial material. A second control electrode is formed from the third conductive material over at least a portion of the second insulating layer and the second sacrificial material. A third insulating layer is deposited over at least a portion of the second control electrode, the second sacrificial material, and the second insulating layer. At least one access hole is formed to the first and second sacrificial materials. The first and second sacrificial materials are removed to form a chamber and sealing the access hole to form a vacuum or a gas filled chamber.
[0012] The present invention provides a switch that utilizes fixed static charge to apply attractive and repulsive forces for activation. With the present invention, the parasitic capacitance is minimal, while the switching speed or response is high. The switch does not add extra mass and only requires one power supply. The present invention can be used in a variety of different applications, such as wireless communications, cell phones, robotics, micro-robotics, and/or autonomous sensors.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 is a cross sectional, side view of a switch in accordance with one embodiment of the present invention;
[0014] FIG. 2A is a cross sectional, side view of a switch in accordance with another embodiment of the present invention; [0015] FIG. 2B is a cross sectional, side view of a switch in accordance with yet another embodiment of the present invention;
[0016] FIGS. 3 and 5-11 are cross sectional, side views of steps in a method of making a switch in accordance with another embodiment of the present invention; and
[0017] FIG. 4 is a partial, cross sectional, top-view of a step in the method of making the switch; and
[0018] FIGS. 12-14 are partial, cross sectional, top-view of additional steps in the method of making the switch.
DETAILED DESCRIPTION
[0019] A switch 10(1) in accordance with at least one embodiment of the present invention is illustrated in FIG. 1. The switch 10(1) includes a switch housing 12 with a chamber 14, separated portions of a conductive line 16(1) and 16(2), a beam 18 with imbedded charge and a contactor 20, and control electrodes 22(1) and 22(2). The present invention provides a switch 10(1) that utilizes fixed static charge to apply attractive and repulsive forces for activation of the switch and to overcome stiction. This switch 10(1) has lower power requirements to operate, less parasitic capacitance, less mass, and faster switching speed or response than prior designs.
[0020] Referring more specifically to FIG. 1, the switch housing 12 defines a chamber 14 in which the switch 10(1) is located. The switch housing 12 is made of several layers of an insulating material, such as silicon dioxide, although other types of materials can be used and the switch housing 12 could comprise a single layer of material in which the chamber 14 is formed. The chamber 14 has a size which is sufficiently large to hold the components of the switch 10(1), although the chamber 14 can have other dimensions. By way of example only, the control electrodes 22(1) and 22(2) in the switch housing 12 may be separated from each other by a distance of about one micron with each of the control electrodes 22(1) and 22(2) spaced from the beam 18 by about 0.5 microns, although these dimensions can vary based on the particular application. The chamber 14 has an access hole 17 used in removing sacrificial material from the chamber 14 although the chamber 14 can have other numbers of access holes. A plug 19 seals the access hole 17. In this embodiment, the chamber 14 is vacuum sealed, although it is not required. The switch housing 12 is vacuum sealed which helps to protect the switch 10(1) from contaminates which, for example, might be attracted and adhere to the beam 18 with the imbedded charge.
[0021] Referring to FIGS. 1 and 4, each of the separated portions 16(1) and 16(2) of the conductive line or conductor has an end 24(1) and 24(2) which is adjacent to and spaced from the other end 24(1) and 24(2) in the chamber 14 to form an open circuit along the conductive line. The other end 26(1) and 26(2) of each of the separated portions of the conductive line extends out from the chamber to form a contact pad. The separated portions 16(1) and 16(2) of the conductive line are made of a conductive material, such as copper, although another material or materials could be used.
[0022] Referring back to FIG. 1, the beam 18 has one end 28(1) which is secured to the switch housing 12 and the other end 28(2) of the beam 18 extends into the chamber 14 and is spaced from the other side of the chamber 14, although other configurations for the beam 18 can be used. For example, both ends 28(1) and 28(2) of the beam 18 could be secured to the switch housing 12, although this embodiment would provide less flexibility than having the beam 18 secured at just one end 28(1) to the switch housing 12 as shown in FIGS. 1 and 2. The beam 18 is made of a material which can hold an imbedded charge. In this particular embodiment, the beam 18 is made of a composite of silicon oxide and silicon nitride, although the beam 18 could be made of another material or materials. By way of example, the beam 18 could be a composite of a plurality of layers of different materials.
[0023] Referring to FIGS. 1 and 4, the contactor 20 is located at or adjacent one end 28(2) of the beam 18, although the contactor 20 could be located in other locations or could be part of the end 28(1) or another section of the beam 18 that was made conductive. The contactor 20 is positioned on the beam 18 to be in substantial alignment with the ends 24(1) and 24(2) of the separated portions 16(1) and 16(2) of the conductive line. In this particular embodiment, the contactor 20 is made of a conductive material, such as copper, although another material or materials could be used. In an open position, the contactor 20 is spaced away from the ends 24(1) and 24(2) of the separated portions 16(1) and 16(2) of the conductive line and in a closed position the contractor 20 is located on the ends 24(1) and 24(2) of each of the separated portions 16(1) and 16(2) of the conductive line to couple the separated portions 16(1) and 16(2) of the conductive line together.
[0024] Referring back to FIG. 1, the control electrodes 22(1) and 22(2) are located in the chamber 14 of the switch housing 12 and are spaced away from opposing sides of the beam 18, although other configurations are possible. For example, one of the control electrodes 22(1) could be located outside of the chamber 14, as shown in the switch 10(2) in FIG. 2 or both of the control electrodes 22(1) and 22(2) could be located outside of the chamber 14. Each of the control electrodes 22(1) and 22(2) is made of a conductive material, such as chrome, although another material or materials could be used. A power supply 30 is coupled to each of the control electrodes 22(1) and 22(2) and is used to apply the potential to the control electrodes 22(1) and 22(2) to open and close the switch 10(1).
[0025] The operation of the switch 10(1) will now be described with reference to FIG. 1. The switch 10(1) is operated by applying a potential across the control electrodes 22(1) and 22(2). When a potential is applied across the control electrodes 22(1) and 22(2), the beam 18 with the imbedded charge is drawn towards one of the control electrodes 22(1) or 22(2) depending on the polarity of the applied potential. This movement of the beam 18 towards one of the control electrodes 22(1) or 22(2) moves the contactor 20 to a closed position resting on ends 24(1) and 24(2) of each of the separated portions 16(1) and 16(2) of the conductive line to couple them together. When the polarity of the applied potential is reversed, the beam 18 is repelled away from the control electrode 22(1) or 22(2) moving the contactor 20 to an open position spaced from the ends 24(1) and 24(2) of each of the separated portions 16(1) and 16(2) of the conductive line to open the connection along the conductive line. Accordingly, the switch 10(1) is controlled by electrostatic forces that can be applied to both close and to open the switch 10(1). No extraneous current path exists, the energy used to open and close the switch is limited to capacitively coupled displacement current, and the dual force directionality overcomes stiction.
[0026] The components and operation of the switches 10(2) 10(3), and
10(4) shown in FIGS. 2 A and 2B are identical to those for the switch 10(1) shown and described with reference FIG. 1, except as described and illustrated herein. Components in FIGS. 2 A and 2B which are identical to components in FIG. 1 have the same reference numeral as those in FIG. 1. In FIG. 2A, control electrode 22(2) is located outside of the chamber 14. A portion 29 of the switch housing 12 separates the control electrode 22(2) from the chamber 14. In this embodiment, portion 29 is made of an insulating material although another material or materials could be used. In an alternative embodiment, control electrode 22(1) could be outside of chamber 14 and control electrode 22(2) could be inside chamber 14. In FIG. 2B, control electrodes 22(1) and 22(2) are located outside of the chamber 14. Portions 29 and 31 of the switch housing 12 separate the control electrodes 22(1) and 22(2) from the chamber 14. In this embodiment, portions 29 and 31 of the switch housing 12 are each made of an insulating material, although another material or materials could be used.
[0027] Referring to FIGS. 3-14, a method for making a switch 10(1) in accordance with at least one embodiment will be described. Referring more specifically to FIGS. 3 and 4, three trenches 32, 34, and 36 are etched into a base material 38. Two of the etched trenches 32 and 34 have ends located adjacent and spaced from each other and are used in the forming the separated portions 16(1) and 16(2) of the conductive line. The other trench 36 is used to form one of the control electrodes 22(1). Although etching is used in this particular embodiment to form the trenches 32, 34, and 36, other techniques for forming the trenches or opening can also be used.
[0028] Next, a conductive material 40 is deposited in the trenches in the base material 38. The conductive material 40 in the two trenches 32 and 34 with the adjacent ends forms the separated portions 16(1) and 16(2) of the conductive line. The conductive material 40 in the other trench 36 forms control electrode 22(1). Next, the conductive material 40 deposited in these trenches 32, 34, and 36 may also be planarized. Again although in this embodiment, the control electrodes 22(1) is formed in the chamber 14 of the switch housing 12, the control electrode 22(1) could be positioned outside of the switch housing 12.
[0029] Referring to FIG. 5, once the separated portions 16(1) and 16(2) of the conductive line and the control electrode 22(1) are formed, an insulating material 42 is deposited over the base material 38 and the conductive material 40 in the trenches 32, 34, and 36. In this particular embodiment, silicon dioxide, SiO2, is used as the insulating material 42, although other types of insulating materials can be used.
[0030] Once the insulating material 42 is deposited, the insulating material 42 is etched to extend down to a portion of the conductive material 40 in the trenches 32, 34, and 36. Next, a sacrificial material 44 is deposited in the etched opening or trench 46 in the insulating material. In this particular embodiment, polysilicon is used as the sacrificial material 44, although another material or materials can be used. Next, the sacrificial material 44 may be planarized. Although etching is used in this particular embodiment to form opening or trench 46, other techniques for forming trenches or openings can be used.
[0031] Referring to FIG. 6, once the sacrificial material 44 is deposited, a trench 48, is etched into the sacrificial material 44 at a location which is in alignment with a portion of the conductive material 40 in the trenches that form the separated portions 16(1) and 16(2) of the conductive line. A conductive material 50 is deposited in the trench 48 in the sacrificial material 44 to form a contactor 20. Next, the conductive material 50 may be planarized. Although etching is used in this particular embodiment to form opening or trench 48, other techniques for forming trenches or openings can be used. [0032] Referring to FIGS. 4 and 7, once the contactor 20 is formed, an insulator 52 comprising a pair of insulating layers is deposited over the insulating material 42, the sacrificial material 44, and the conductive material 44 that forms the contactor 20. The insulator 52 is patterned to form a cantilever charge holding beam 18 which extends from the insulating layer 42 across a portion of the sacrificial layer 44 and is connected to the contactor 20. Although in this particular embodiment the beam 18 is patterned, other techniques for forming the beam 18 can be used. Additionally, although in this embodiment insulator 52 comprises two insulating layers, insulator 52 can be made of more or fewer layers and can be made of another material or materials that can hold fixed charge.
[0033] Referring to FIG. 8, once the beam 18 is formed, an insulating material 54 is deposited over the insulating material 42, the beam 18, and the sacrificial material 44. A trench 56 is etched into the insulating material 54 which extends down to a portion of the beam 18 and the sacrificial material 44. A sacrificial material 58 is deposited in the trench 56 in the insulating material 54. The sacrificial material 58 can be planarized. Sacrificial material 58 can be made of the same or a different material from sacrificial layer 44 and in this embodiment is polysilicon, although another material or materials could be used. Although etching is used in this particular embodiment to form opening or trench 56, other techniques for forming trenches or openings can be used.
[0034] Referring to FIG. 9, electrons are injected into the beam 18 from a ballistic energy source 60 to imbed charge in the beam 18, although other techniques for imbedding the electrons can be used, such as applying an electrical bias to the beam 18.
[0035] Referring to FIG. 10, a conductive material 62 is deposited over the insulating material 54 and the sacrificial material 58. The conductive material 62 is etched to form a control electrode 22(2) for the switch 10(1). Although in this particular embodiment the control electrode 22(2) is formed by patterning, other techniques for forming the control electrode can be used. [0036] Referring to FIG. 11, once control electrode 22(1) is formed, an insulating material 64 is deposited over the conductive material, the sacrificial material, and the insulating material. The base material 38 and insulating materials 42, 54, and 64 form the switch housing 12 with the chamber 14 which is filled with the sacrificial materials 44 and 58, although switch housing 12 could be made from one or other numbers of layers.
[0037] Referring to FIG. 12, an access hole 66 is drilled through the insulating layer 64 to the sacrificial material 58. Although in this particular embodiment a single access hole 66 is etched, other numbers of access holes can be formed and the hole or holes can be formed through other materials to the sacrificial material 44 and 58. Contact vias to separated portions 16(1) and 16(2) of the conductive line and control electrodes 22(1) and 22(2) may also be etched or otherwise formed at this time.
[0038] Referring to FIG. 13, once the access hole 66 is formed, the sacrificial materials 44 and 58 removed using xenon difluoride (XeF2) via the access hole 66, although other techniques for removing sacrificial materials 44 and 58 can be used.
[0039] Referring to FIG. 14, once the sacrificial materials 44 and 58 are removed, aluminum is deposited in the access hole 66 to form a plug 68 to seal the chamber 14, although another material or materials can be used for the plug 68. In this embodiment, the chamber 14 is vacuum sealed when the sacrificial materials 44 and 58 are removed and access hole 66 is sealed with a plug 68, although the chamber 14 does not have to be vacuum sealed. Once the chamber 14 is sealed, the switch is ready for use.
[0040] Accordingly, the present invention provides a switch that utilizes fixed static charge to apply attractive and repulsive forces for activation and is easy to manufacture. Although one method for making a switch is disclosed, other steps in this method and other methods for making the switch can also be used. For example, other techniques for imbedding charge in the beam can be used, such as applying a bias to the beam to imbed charge. [0041] Having thus described the basic concept of the invention, it will be rather apparent to those skilled in the art that the foregoing detailed disclosure is intended to be presented by way of example only, and is not limiting. Various alterations, improvements, and modifications will occur and are intended to those skilled in the art, though not expressly stated herein. These alterations, improvements, and modifications are intended to be suggested hereby, and are within the spirit and scope of the invention. Additionally, the recited order of processing elements or sequences, or the use of numbers, letters, or other designations therefor, is not intended to limit the claimed processes to any order except as may be specified in the claims. Accordingly, the invention is limited only by the following claims and equivalents thereto.

Claims

CLAIMSWhat is claimed is:
1. A switch comprising: at least one portion of a conductive line; a beam with imbedded charge, the beam having a conductive section which is positioned in substantial alignment with the at least one portion of the conductive line, the conductive section of the beam having an open position spaced away from the at least one portion of the conductive line and a closed position on the at least one portion of the conductive line; an control electrodes, each of the control electrodes spaced away from an opposing side of the beam to control movement of the beam.
2. The switch as set forth in claim 1 further comprising a switch housing with a chamber, the beam extending into the chamber and the at least one portion of a conductive line is in the chamber.
3. The switch as set forth in claim 2 wherein at least one of the control electrodes is located in the chamber.
4. The switch as set forth in claim 2 wherein the control electrodes are all located in the switch housing.
5. The switch as set forth in claim 2 wherein the control electrodes are all located outside the chamber in the switch housing.
The switch as set forth in claim 2 further comprising: an opening into the chamber; and a plug sealing the opening into the chamber.
7. The switch as set forth in claim 2 wherein the chamber is a vacuum chamber.
8. The switch as set forth in claim 2 wherein the chamber is a filled with at least one gas.
9. The switch as set forth in claim 1 wherein the conductive section is located at or adjacent an end of the beam.
10. The switch as set forth in claim 1 wherein the conductive section is a contactor connected to the beam.
11. The switch as set forth in claim 1 wherein the at least one portion of a conductive line comprises a pair of separated portions of a conductive line, the conductive section is positioned in substantial alignment with the separated portions of the conductive line.
12. A method of using a switch, the switch having a beam with imbedded charge and control electrodes, the beam having a conductive section located at or adjacent an edge of the beam and which is positioned in substantial alignment with at least one portion of a conductive line, each of the control electrodes spaced away from an opposing side of the beam to control movement of the beam, the method comprising: applying a potential with a first polarity to the control electrodes; and moving the conductive section on to one of an open position spaced away from the at least one portion of the conductive line or a closed position on the at least one portion of the conductive line in response to the first polarity of the applied potential.
13. The method as set forth in claim 11 further comprising: applying a potential with a second polarity to the control electrodes; and moving the conductive section on to one of an open position spaced away from the at least one portion of the conductive line or a closed position on the at least one portion of the conductive line in response to the second polarity of the applied potential.
14. The method as set forth in claim 12 wherein the first polarity is opposite from the second polarity.
15. The method as set forth in claim 12 wherein the beam extends into a chamber in a switch housing and the at least one portion of a conductive line is in the chamber.
16. The method as set forth in claim 15 wherein at least one of the control electrodes is located in the chamber.
17. The method as set forth in claim 15 wherein the control electrodes are all located in the chamber in the switch housing.
18. The method as set forth in claim 15 wherein the control electrodes are all located outside the chamber in the switch housing.
19. The method as set forth in claim 15 wherein the chamber is a vacuum chamber.
20. The method as set forth in claim 15 wherein the chamber is filled with at least one gas.
21. The method as set forth in claim 12 wherein the conductive section is located at or adjacent an end of the beam.
22. The method as set forth in claim 12 wherein the conductive section is a contactor connected to the beam.
23. A method for making a switch, the method comprising: forming at least one portion of a conductive line; forming a beam with imbedded charge, the beam at least having a conductive section which is positioned in substantial alignment with the at least one portion of the conductive line, the conductive section of the beam having an open position spaced away from the at least one portion of the conductive line and a closed position on the at least one portion of the conductive line; and forming control electrodes, each of the control electrodes spaced away from an opposing side of the beam to control movement of the beam.
24. The method as set forth in claim 23 further comprising forming a chamber in a switch housing, the at least one portion of the conductive line is in the chamber and the beam extends into the chamber.
25. The method as set forth in claim 24 wherein the forming the chamber in the switch housing further comprises: depositing a first insulating layer on at least a portion of one of the control electrodes and a base material; forming a trench in the first insulating layer; filling the trench in the first insulating layer with a first sacrificial material; depositing a second insulating layer over at least a portion of the beam, the first sacrificial material, and the first insulating layer; forming a trench in a portion of the second insulating layer which extends to at least the beam and the first sacrificial material; filling the trench in the portion of the second insulating layer with a second sacrificial material; depositing a third insulating layer on at least a portion of another one of the control electrodes, the second sacrificial material, and the second insulating layer; forming at least one access hole to the first and second sacrificial materials; and removing the first and second sacrificial materials to form the chamber; and sealing the access hole.
26. The method as set forth in claim 23 wherein the forming the at least one portion of the conductive line further comprises forming separated portions of the conductive line, the conductive section of the beam is positioned in substantial alignment with the separated portions of the conductive line.
27. The method as set forth in claim 26 wherein the forming the separated portions of the conductive line in the chamber further comprises filling at least two trenches in a base material with a first conductive material, wherein the first conductive material in the at least two trenches forms a separated portions of a conductive line
28. The method as set forth in claim 23 wherein the forming a beam further comprises: depositing a fourth insulating material over at least a portion of a first insulating layer which forms part of the switch housing and a first sacrificial material in a trench in the first insulating layer, the trench defining a portion of the chamber; depositing a fifth insulating material over at least a portion of the fourth insulating layer, the beam formed from the fourth and fifth insulating materials.
29. The method as set forth in claim 27 wherein the forming the beam further comprises injecting electrons into the beam forming the imbedded charge in the beam.
30. The method as set forth in claim 27 wherein the forming the beam further comprises: forming a trench in a portion of the first sacrificial material which is at least partially in alignment with at least a portion of a first conductive material in trenches in a base material that form the separated portions of the conductive line; and filling the trench in the portion of the first sacrificial material with a second conductive material to form a contactor, wherein the contactor is connected to the beam.
31. The method as set forth in claim 23 wherein the forming the control electrodes further comprises: filling at least one trench in a base material with a first conductive material, wherein the first conductive material in the trench forms one of the pair of control electrodes; and forming another one of the pair of control electrodes from a third conductive material over at least a portion of a second insulating layer which forms part of the switch housing and a second sacrificial material in a trench in the second insulating layer.
32. A method for making a switch, the method comprising: filling at least three trenches in a base material with a first conductive material, wherein the first conductive material in two of the trenches forms a separated portions of a conductive line and the first conductive material in the other trench forms a first control electrode; depositing a first insulating layer on at least a portion of the first conductive material and the base material; forming a trench in a portion of the first insulating layer which extends to at least a portion of the first conductive material; filling the trench in the portion of the first insulating layer with a first sacrificial material; forming a beam from at least one the charge holding material over at least a portion of the first insulating layer and the first sacrificial material, the beam having a conductive section which is at least partially in alignment with at least a part of the first conductive material in the trenches in the base material that form the separated portions of the conductive line; depositing a second insulating layer over at least a portion of the beam, the first sacrificial material, and the first insulating layer; forming a trench in the second insulating layer which extends to at least a portion of the beam and the first sacrificial material; filling the trench in the second insulating layer with a second sacrificial material; charging the beam; depositing a second conductive material over at least a portion of the second insulating layer and the second sacrificial material; forming a second control electrode from the second conductive material over at least a portion of the second insulating layer and the second sacrificial material; depositing a third insulating layer over at least a portion of the second control electrode, the second sacrificial material, and the second insulating layer; forming at least one access hole to the first and second sacrificial materials; and removing the first and second sacrificial materials to form a chamber and sealing the access hole.
33. The switch as set forth in claim 32 further comprising: forming a trench in the first sacrificial material which is at least partially in alignment with at least a part of the first conductive material in the trenches in the base material that form the separated portions of the conductive line; and filling the trench in the first sacrificial material with a third conductive material to form the conductive section of the beam.
34. The switch as set forth in claim 32 further comprising vacuum sealing the chamber.
35. The switch as set forth in claim 32 wherein the forming a beam from at least one the charge holding material comprises depositing two or more insulating materials forming a beam from at least one the charge holding material.
PCT/US2002/007518 2001-03-13 2002-03-12 A micro-electro-mechanical switch and a method of using and making thereof WO2002073673A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27538601P 2001-03-13 2001-03-13
US60/275,386 2001-03-13

Publications (2)

Publication Number Publication Date
WO2002073673A1 WO2002073673A1 (en) 2002-09-19
WO2002073673A9 true WO2002073673A9 (en) 2004-04-08

Family

ID=23052073

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/007518 WO2002073673A1 (en) 2001-03-13 2002-03-12 A micro-electro-mechanical switch and a method of using and making thereof

Country Status (2)

Country Link
US (1) US7280014B2 (en)
WO (1) WO2002073673A1 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6829092B2 (en) * 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US20040031912A1 (en) * 2001-10-31 2004-02-19 Wong Marvin Glenn Method of eliminating brownian noise in micromachined varactors
EP1454349B1 (en) 2001-11-09 2006-09-27 WiSpry, Inc. Trilayered beam mems device and related methods
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
AU2003243546A1 (en) * 2002-06-13 2003-12-31 Wispry, Inc. Micro-electro-mechanical system (mems) variable capacitor apparatuses and related methods
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
JP2004134370A (en) * 2002-07-26 2004-04-30 Matsushita Electric Ind Co Ltd Switch
KR100506283B1 (en) * 2003-01-14 2005-08-05 삼성전자주식회사 Ear-microphone connection apparatus by using a interface connector of portable phone
US6967718B1 (en) 2003-02-28 2005-11-22 Silicon Light Machines Corportion Method and apparatus for monitoring WDM channels and for analyzing dispersed spectrum of light
JP4333417B2 (en) * 2003-04-02 2009-09-16 ソニー株式会社 Micromachine manufacturing method
US8581308B2 (en) 2004-02-19 2013-11-12 Rochester Institute Of Technology High temperature embedded charge devices and methods thereof
DE102004010150B9 (en) * 2004-02-27 2012-01-26 Eads Deutschland Gmbh High-frequency MEMS switch with bent switching element and method for its production
US7362199B2 (en) * 2004-03-31 2008-04-22 Intel Corporation Collapsible contact switch
WO2006000731A1 (en) * 2004-06-14 2006-01-05 Stmicroelectronics Sa Piezoelectrically-controlled microswitch
US7683746B2 (en) * 2005-01-21 2010-03-23 Panasonic Corporation Electro-mechanical switch
US20070046214A1 (en) * 2005-08-26 2007-03-01 Pasch Nicholas F Apparatus comprising an array of switches and display
EP1999772B1 (en) * 2006-03-08 2020-05-06 Wispry, Inc. Micro-electro-mechanical system mems variable capacitor
US20070236307A1 (en) * 2006-04-10 2007-10-11 Lianjun Liu Methods and apparatus for a packaged MEMS switch
JP5127210B2 (en) * 2006-11-30 2013-01-23 株式会社日立製作所 Semiconductor device in which MEMS sensor is embedded
KR100882148B1 (en) * 2007-06-22 2009-02-06 한국과학기술원 Electrostatic actuator, the method of actuating the same and applicable devices using thereof
US7830066B2 (en) * 2007-07-26 2010-11-09 Freescale Semiconductor, Inc. Micromechanical device with piezoelectric and electrostatic actuation and method therefor
JP2009043537A (en) * 2007-08-08 2009-02-26 Toshiba Corp Mems switch, and its manufacturing method
US7692519B2 (en) * 2007-12-21 2010-04-06 General Electric Company MEMS switch with improved standoff voltage control
US8451077B2 (en) * 2008-04-22 2013-05-28 International Business Machines Corporation MEMS switches with reduced switching voltage and methods of manufacture
JP5126038B2 (en) * 2008-12-08 2013-01-23 オムロン株式会社 Electrostatic induction type energy conversion element
US9892879B2 (en) * 2011-01-11 2018-02-13 Qorvo Us, Inc. Encapsulated micro-electromechanical system switch and method of manufacturing the same
US8115989B2 (en) * 2009-09-17 2012-02-14 Qualcomm Mems Technologies, Inc. Anti-stiction electrode
US20110168378A1 (en) * 2010-01-14 2011-07-14 Irvine Sensors Corporation Thermal power distribution system
US9446940B2 (en) 2014-10-03 2016-09-20 Freescale Semiconductor, Inc. Stress isolation for MEMS device
US9837526B2 (en) 2014-12-08 2017-12-05 Nxp Usa, Inc. Semiconductor device wtih an interconnecting semiconductor electrode between first and second semiconductor electrodes and method of manufacture therefor
US9458008B1 (en) * 2015-03-16 2016-10-04 Freescale Semiconductor, Inc. Method of making a MEMS die having a MEMS device on a suspended structure
US10348295B2 (en) 2015-11-19 2019-07-09 Nxp Usa, Inc. Packaged unidirectional power transistor and control circuit therefore
KR20170069806A (en) * 2015-12-11 2017-06-21 현대자동차주식회사 Manufacturing method of micro electro mechanical system sensor
CN111446089B (en) * 2020-03-12 2022-04-26 上海集成电路研发中心有限公司 MEMS switch structure and manufacturing method
FR3110284B1 (en) * 2020-05-14 2023-01-13 Commissariat Energie Atomique Detection device using piezoresistive transduction

Family Cites Families (148)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2567373A (en) 1949-06-10 1951-09-11 Rca Corp Electrostatic generator
US2588513A (en) 1949-06-10 1952-03-11 Rca Corp Electrostatic high-voltage generator
US2978066A (en) 1959-05-07 1961-04-04 Honeywell Regulator Co Gas cleaning apparatus
US3118022A (en) 1961-08-07 1964-01-14 Bell Telephone Labor Inc Electroacoustic transducer
US3487610A (en) 1965-03-26 1970-01-06 Du Pont Electrostatic filter unit with high stable charge and its manufacture
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3405334A (en) 1967-03-06 1968-10-08 Homer H. Jewett Electrostatic power generator driven by pneumatic power means
JPS5220851B1 (en) 1969-12-11 1977-06-07
FR2124055B1 (en) 1971-02-02 1975-03-21 Onera (Off Nat Aerospatiale)
US3715500A (en) 1971-07-21 1973-02-06 Bell Telephone Labor Inc Unidirectional microphones
US3731163A (en) 1972-03-22 1973-05-01 United Aircraft Corp Low voltage charge storage memory element
US3786495A (en) 1972-05-17 1974-01-15 Ncr Stored charge transducer
JPS5650408B2 (en) 1973-07-05 1981-11-28
US4047214A (en) 1975-09-04 1977-09-06 Westinghouse Electric Corporation Electrostatically bonded dielectric-on-semiconductor device, and a method of making the same
US4115914A (en) 1976-03-26 1978-09-26 Hughes Aircraft Company Electrically erasable non-volatile semiconductor memory
US4102202A (en) 1976-11-26 1978-07-25 The Singer Company Electrostatic accelerometer
US4126822A (en) 1977-05-27 1978-11-21 Wahlstrom Sven E Electrostatic generator and motor
US4166729A (en) 1977-07-26 1979-09-04 The United States Of America As Represented By The Secretary Of The Navy Collector plates for electrostatic precipitators
US4160882A (en) 1978-03-13 1979-07-10 Driver Michael L Double diaphragm electrostatic transducer each diaphragm comprising two plastic sheets having different charge carrying characteristics
US4285714A (en) 1978-12-07 1981-08-25 Spire Corporation Electrostatic bonding using externally applied pressure
JPS5938655B2 (en) 1979-05-14 1984-09-18 日本放送協会 semiconductor disk memory device
US4288735A (en) 1979-09-17 1981-09-08 Mcdonnell Douglas Corp. Vibrating electret reed voltage generator
US4375718A (en) 1981-03-12 1983-03-08 Surgikos, Inc. Method of making fibrous electrets
GB2124147B (en) 1982-07-21 1985-11-13 Johnson James F J Releasably mutually-adherent materials
US4513049A (en) 1983-04-26 1985-04-23 Mitsui Petrochemical Industries, Ltd. Electret article
US4490772A (en) 1983-06-13 1984-12-25 Blickstein Martin J Voltage and mechanically variable trimmer capacitor
US4585209A (en) 1983-10-27 1986-04-29 Harry E. Aine Miniature valve and method of making same
US4944854A (en) 1983-11-08 1990-07-31 Celanese Corporation Electret process and products
US4581624A (en) 1984-03-01 1986-04-08 Allied Corporation Microminiature semiconductor valve
DE3509857C2 (en) 1984-03-19 1994-04-28 Toyo Boseki Electretized dust filter and its manufacture
JPS60225416A (en) 1984-04-24 1985-11-09 三井化学株式会社 High performance electret and air filter
FR2563959B1 (en) 1984-05-04 1990-08-10 Lewiner Jacques IMPROVEMENTS ON ELECTRE-ACOUSTIC TRANSDUCERS WITH ELECTRET
US4794370A (en) 1984-08-21 1988-12-27 Bos-Knox Ltd. Peristaltic electrostatic binary device
US4874659A (en) 1984-10-24 1989-10-17 Toray Industries Electret fiber sheet and method of producing same
US4701640A (en) 1985-03-11 1987-10-20 Telex Communications, Inc. Electret transducer and method of fabrication
US5054081B1 (en) 1985-04-02 1994-06-28 Roger A West Electrostatic transducer with improved bass response utilizing distributed bass resonance energy
EP0213825A3 (en) 1985-08-22 1989-04-26 Molecular Devices Corporation Multiple chemically modulated capacitance
US4736629A (en) 1985-12-20 1988-04-12 Silicon Designs, Inc. Micro-miniature accelerometer
US4675960A (en) 1985-12-30 1987-06-30 Motorola, Inc. Method of manufacturing an electrically variable piezoelectric hybrid capacitor
US4922756A (en) 1988-06-20 1990-05-08 Triton Technologies, Inc. Micro-machined accelerometer
US4997521A (en) 1987-05-20 1991-03-05 Massachusetts Institute Of Technology Electrostatic micromotor
US5207103A (en) 1987-06-01 1993-05-04 Wise Kensall D Ultraminiature single-crystal sensor with movable member
US5189641A (en) 1987-06-08 1993-02-23 Fujitsu Limited Non-volatile random access memory device
JPS6432494A (en) 1987-07-27 1989-02-02 Mitsubishi Electric Corp Non-volatile semiconductor storage device
US4789803A (en) 1987-08-04 1988-12-06 Sarcos, Inc. Micropositioner systems and methods
DE3839956C2 (en) 1987-11-28 1998-07-02 Toyo Boseki Electret film and process for its production
JP2672329B2 (en) 1988-05-13 1997-11-05 東レ株式会社 Electret material
US4905701A (en) 1988-06-15 1990-03-06 National Research Development Corporation Apparatus and method for detecting small changes in attached mass of piezoelectric devices used as sensors
US4965244A (en) 1988-09-19 1990-10-23 Regents Of The University Of Minnesota CaF2 passivation layers for high temperature superconductors
EP0366423B1 (en) 1988-10-25 1994-05-25 Matsushita Electronics Corporation Manufacturing method of semiconductor non-volatile memory device
US5020030A (en) 1988-10-31 1991-05-28 Huber Robert J Nonvolatile SNOS memory cell with induced capacitor
CA1314237C (en) 1988-11-01 1993-03-09 William E. Pick Charging element having odour absorbing properties for an electrostatic air filter
JPH0623782B2 (en) 1988-11-15 1994-03-30 株式会社日立製作所 Capacitance type acceleration sensor and semiconductor pressure sensor
US5231045A (en) 1988-12-08 1993-07-27 Fujitsu Limited Method of producing semiconductor-on-insulator structure by besol process with charged insulating layers
US4996627A (en) 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
KR930001165Y1 (en) 1989-05-24 1993-03-13 미쓰비시덴키 가부시키가이샤 Accelerometer
US5143854A (en) 1989-06-07 1992-09-01 Affymax Technologies N.V. Large scale photolithographic solid phase synthesis of polypeptides and receptor binding screening thereof
US5156810A (en) 1989-06-15 1992-10-20 Biocircuits Corporation Biosensors employing electrical, optical and mechanical signals
DE69029478T2 (en) 1989-06-23 1997-05-15 Univ Leland Stanford Junior METHOD AND DEVICE FOR STORING NUMERICAL INFORMATION IN THE FORM OF STORED LOADS
US5050435A (en) 1989-07-18 1991-09-24 The Boeing Company Position detection system for a suspended particle accelerometer
US5238223A (en) 1989-08-11 1993-08-24 Robert Bosch Gmbh Method of making a microvalve
GB8921722D0 (en) * 1989-09-26 1989-11-08 British Telecomm Micromechanical switch
US5092174A (en) 1989-10-19 1992-03-03 Texas Instruments Incorporated Capacitance accelerometer
DE69032950T2 (en) * 1989-11-29 1999-09-16 Dainippon Printing Co Ltd Electrostatic charge information reproduction process
US5180623A (en) 1989-12-27 1993-01-19 Honeywell Inc. Electronic microvalve apparatus and fabrication
US5082242A (en) 1989-12-27 1992-01-21 Ulrich Bonne Electronic microvalve apparatus and fabrication
US5228373A (en) 1990-01-08 1993-07-20 Robert A. Foisie Method and apparatus using electrostatic charges to temporarily hold packets of paper
US5118942A (en) 1990-02-05 1992-06-02 Hamade Thomas A Electrostatic charging apparatus and method
US5473945A (en) * 1990-02-14 1995-12-12 The Charles Stark Draper Laboratory, Inc. Micromechanical angular accelerometer with auxiliary linear accelerometer
DE4006152A1 (en) 1990-02-27 1991-08-29 Fraunhofer Ges Forschung MICROMINIATURIZED PUMP
CA2037942A1 (en) 1990-03-12 1991-09-13 Satoshi Matsuura Process for producing an electret, a film electret, and an electret filter
US5096388A (en) 1990-03-22 1992-03-17 The Charles Stark Draper Laboratory, Inc. Microfabricated pump
EP0459723B1 (en) 1990-05-30 1996-01-17 Hitachi, Ltd. Semiconductor acceleration sensor and vehicle control system using the same
DE69104585T2 (en) 1990-10-30 1995-05-18 Hewlett Packard Co Micropump.
US5334238A (en) 1990-11-27 1994-08-02 United Technologies Corporation Cleaner method for electrostatic precipitator
US5205171A (en) 1991-01-11 1993-04-27 Northrop Corporation Miniature silicon accelerometer and method
US5481184A (en) * 1991-12-31 1996-01-02 Sarcos Group Movement actuator/sensor systems
US5081513A (en) 1991-02-28 1992-01-14 Xerox Corporation Electronic device with recovery layer proximate to active layer
JPH04335538A (en) 1991-05-10 1992-11-24 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
DE69213340T2 (en) 1991-05-30 1997-03-27 Hitachi Ltd Valve and its use in a device made of semiconductor material
US5512882A (en) 1991-08-07 1996-04-30 Transducer Research, Inc. Chemical sensing apparatus and methods
US5176358A (en) 1991-08-08 1993-01-05 Honeywell Inc. Microstructure gas valve control
JP2804196B2 (en) 1991-10-18 1998-09-24 株式会社日立製作所 Microsensor and control system using the same
US5284692A (en) 1991-10-24 1994-02-08 Bell Dennis J Electrostatic evacuated insulating sheet
JP2896725B2 (en) 1991-12-26 1999-05-31 株式会社山武 Capacitive pressure sensor
DE4200343C2 (en) 1992-01-09 1993-11-11 Metallgesellschaft Ag Electrostatic separator
US5365790A (en) 1992-04-02 1994-11-22 Motorola, Inc. Device with bonded conductive and insulating substrates and method therefore
US5355577A (en) 1992-06-23 1994-10-18 Cohn Michael B Method and apparatus for the assembly of microfabricated devices
US5474599A (en) 1992-08-11 1995-12-12 United Air Specialists, Inc. Apparatus for electrostatically cleaning particulates from air
US5441597A (en) 1992-12-01 1995-08-15 Honeywell Inc. Microstructure gas valve control forming method
US5491604A (en) 1992-12-11 1996-02-13 The Regents Of The University Of California Q-controlled microresonators and tunable electronic filters using such resonators
JP2555922B2 (en) 1993-02-26 1996-11-20 日本電気株式会社 Electrostatically driven micro shutters and shutter arrays
US5419953A (en) 1993-05-20 1995-05-30 Chapman; Rick L. Multilayer composite air filtration media
US6199874B1 (en) * 1993-05-26 2001-03-13 Cornell Research Foundation Inc. Microelectromechanical accelerometer for automotive applications
US5526172A (en) 1993-07-27 1996-06-11 Texas Instruments Incorporated Microminiature, monolithic, variable electrical signal processor and apparatus including same
US5417235A (en) 1993-07-28 1995-05-23 Regents Of The University Of Michigan Integrated microvalve structures with monolithic microflow controller
ES2128590T3 (en) 1993-08-17 1999-05-16 Minnesota Mining & Mfg METHOD FOR LOADING FILTERS WITH ELECTRETES.
JP2810302B2 (en) 1993-10-01 1998-10-15 ティーディーケイ株式会社 Small pump
JPH07191055A (en) * 1993-12-27 1995-07-28 Hitachi Ltd Capacitive acceleration sensor
US5445008A (en) 1994-03-24 1995-08-29 Martin Marietta Energy Systems, Inc. Microbar sensor
US5549735C1 (en) 1994-06-09 2001-08-14 Coppom Technologies Electrostatic fibrous filter
JP3383081B2 (en) * 1994-07-12 2003-03-04 三菱電機株式会社 Electronic component manufactured using anodic bonding and method of manufacturing electronic component
US5596194A (en) * 1994-08-19 1997-01-21 Hughes Aircraft Company Single-wafer tunneling sensor and low-cost IC manufacturing method
US5567336A (en) 1994-10-24 1996-10-22 Matsushita Electric Industrial Co., Ltd. Laser ablation forward metal deposition with electrostatic assisted bonding
US5488864A (en) 1994-12-19 1996-02-06 Ford Motor Company Torsion beam accelerometer with slotted tilt plate
US5593479A (en) * 1995-02-02 1997-01-14 Hmi Industries, Inc. Filter system
US5591679A (en) 1995-04-12 1997-01-07 Sensonor A/S Sealed cavity arrangement method
US5640133A (en) * 1995-06-23 1997-06-17 Cornell Research Foundation, Inc. Capacitance based tunable micromechanical resonators
US6168948B1 (en) * 1995-06-29 2001-01-02 Affymetrix, Inc. Miniaturized genetic analysis systems and methods
US5771148A (en) * 1995-11-17 1998-06-23 Motorola, Inc. Intercalation-based voltage variable capacitor
ATE294461T1 (en) * 1996-02-10 2005-05-15 Fraunhofer Ges Forschung BISTABLE MICRO DRIVE WITH COUPLED MEMBRANES
US5897097A (en) * 1996-09-06 1999-04-27 Xerox Corporation Passively addressable fluid valves having S-shaped blocking films
US6033852A (en) * 1996-09-27 2000-03-07 University Of Maine Monolithic piezoelectric sensor (MPS) for sensing chemical, biochemical and physical measurands
DE19743749A1 (en) * 1996-10-03 1998-04-09 Hitachi Ltd Semiconductor pressure sensor for absolute pressure measurement
US5871567A (en) * 1996-12-12 1999-02-16 Dana Corporation Dual Media air filter with electrostatic charge
US5874675A (en) * 1997-03-20 1999-02-23 Interscience, Inc. Wideband vibration sensor
DE19719861A1 (en) * 1997-05-12 1998-11-19 Fraunhofer Ges Forschung Method of manufacturing a micromembrane pump body
US5914553A (en) * 1997-06-16 1999-06-22 Cornell Research Foundation, Inc. Multistable tunable micromechanical resonators
US5908603A (en) * 1997-07-03 1999-06-01 Industrial Technology Research Institute Ozone generator having micro pump
US6037797A (en) * 1997-07-11 2000-03-14 Semiconductor Diagnostics, Inc. Measurement of the interface trap charge in an oxide semiconductor layer interface
US6238466B1 (en) * 1997-10-01 2001-05-29 3M Innovative Properties Company Electret articles and filters with increased oily mist resistance
US6048692A (en) * 1997-10-07 2000-04-11 Motorola, Inc. Sensors for electrically sensing binding events for supported molecular receptors
US6393895B1 (en) * 1997-10-08 2002-05-28 Symyx Technologies, Inc. Method and apparatus for characterizing materials by using a mechanical resonator
US6177351B1 (en) * 1997-12-24 2001-01-23 Texas Instruments Incorporated Method and structure for etching a thin film perovskite layer
US6032923A (en) * 1998-01-08 2000-03-07 Xerox Corporation Fluid valves having cantilevered blocking films
KR100279053B1 (en) * 1998-01-09 2001-02-01 박호군 Electrostatic Thermal Bonding Method of Glass Substrate Pair Using Silicon Thin Film
EP0951068A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
FI108583B (en) * 1998-06-02 2002-02-15 Nokia Corp resonator structures
US6238946B1 (en) * 1999-08-17 2001-05-29 International Business Machines Corporation Process for fabricating single crystal resonant devices that are compatible with integrated circuit processing
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
DE10004393C1 (en) * 2000-02-02 2002-02-14 Infineon Technologies Ag micro-relay
US6482639B2 (en) * 2000-06-23 2002-11-19 The United States Of America As Represented By The Secretary Of The Navy Microelectronic device and method for label-free detection and quantification of biological and chemical molecules
DE10036911C2 (en) * 2000-07-28 2002-06-06 Infineon Technologies Ag Method for producing a multi-bit memory cell
DE10038877A1 (en) * 2000-08-09 2002-02-28 Infineon Technologies Ag Memory cell and manufacturing process
US6504118B2 (en) * 2000-10-27 2003-01-07 Daniel J Hyman Microfabricated double-throw relay with multimorph actuator and electrostatic latch mechanism
AU2002303933A1 (en) * 2001-05-31 2002-12-09 Rochester Institute Of Technology Fluidic valves, agitators, and pumps and methods thereof
US6841917B2 (en) * 2001-06-11 2005-01-11 Rochester Institute Of Technology Electrostatic levitation and attraction systems and methods
US6707355B1 (en) * 2001-06-29 2004-03-16 Teravicta Technologies, Inc. Gradually-actuating micromechanical device
US6842009B2 (en) * 2001-09-13 2005-01-11 Nth Tech Corporation Biohazard sensing system and methods thereof
US6717488B2 (en) * 2001-09-13 2004-04-06 Nth Tech Corporation Resonator with a member having an embedded charge and a method of making thereof
US6688179B2 (en) * 2001-10-26 2004-02-10 Nth Tech Corporation Electrostatic pressure transducer and a method thereof
US20040023236A1 (en) * 2001-10-26 2004-02-05 Potter Michael D. Chemical and biological hazard sensor system and methods thereof
WO2003038969A2 (en) * 2001-10-26 2003-05-08 Potter Michael D An electrostatic based power source and methods thereof
WO2003038448A1 (en) * 2001-10-26 2003-05-08 Potter Michael D An accelerometer and methods thereof
US20030080839A1 (en) * 2001-10-31 2003-05-01 Wong Marvin Glenn Method for improving the power handling capacity of MEMS switches
FI118622B (en) * 2002-01-17 2008-01-15 Band Oy B Musical instrument converter and method of making it
US7287328B2 (en) * 2003-08-29 2007-10-30 Rochester Institute Of Technology Methods for distributed electrode injection
US7217582B2 (en) * 2003-08-29 2007-05-15 Rochester Institute Of Technology Method for non-damaging charge injection and a system thereof

Also Published As

Publication number Publication date
US20020131228A1 (en) 2002-09-19
US7280014B2 (en) 2007-10-09
WO2002073673A1 (en) 2002-09-19

Similar Documents

Publication Publication Date Title
US7280014B2 (en) Micro-electro-mechanical switch and a method of using and making thereof
US8111118B2 (en) Multi-stable micro electromechanical switches and methods of fabricating same
US6701779B2 (en) Perpendicular torsion micro-electromechanical switch
US6731492B2 (en) Overdrive structures for flexible electrostatic switch
US6229683B1 (en) High voltage micromachined electrostatic switch
CN101276707B (en) MEMS device and portable communication terminal with said MEMS device
US6621135B1 (en) Microrelays and microrelay fabrication and operating methods
JP2005536847A (en) Diaphragm actuated micro electromechanical switch
KR20010030305A (en) Folded spring based micro electromechanical RF switch and method of making
WO2002073671A9 (en) A micro-electro-mechanical varactor and a method of making and using
KR101745722B1 (en) Micro-electromechanical system switch
IL161654A (en) Method of fabricating micro-electromechanical switches on cmos compatible substrates
JP2001179699A (en) Double microelectronic machine actuator device
KR100492004B1 (en) Radio frequency device using microelectronicmechanical system technology
US8207460B2 (en) Electrostatically actuated non-latching and latching RF-MEMS switch
KR101832134B1 (en) Electrostatically actuated micro-mechanical switching device
US20070217120A1 (en) Microelectrical Device With Space Charge Effect
JP2004319498A (en) Insertion type liquid metal latching relay
WO2004059678A1 (en) Push/pull actuator for microstructures
US20020097118A1 (en) Current actuated switch
US20220328258A1 (en) Mems switch including an embedded metal contact
JP5763942B2 (en) High frequency MEMS switch
KR20040053127A (en) A micromechanical switch and method of manufacturing the same
KR100636351B1 (en) Electrostatic driven RF MEMS switch and manufacturing thereof
KR20040111354A (en) Microswitch with a micro-electromechanical system

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

COP Corrected version of pamphlet

Free format text: PAGES 1/15-15/15, DRAWINGS, REPLACED BY NEW PAGES 1/15-15/15; DUE TO LATE TRANSMITTAL BY THE RECEIVING OFFICE

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP